HanmiGlobal Takes Lead on SK hynix Indiana Advanced Packaging Plant Through 2028
HanmiGlobal will manage the construction of SK hynix's first U.S. advanced chip-packaging fab in West Lafayette, Indiana, with clean-room work slated for completion by October 2028.
HanmiGlobal announced that it is responsible for steering the build-out of SK hynix's inaugural U.S. advanced packaging plant located in West Lafayette, Indiana. The firm entered the project in August 2024, during the pre-construction phase, and will remain in charge through to the plant's completion, scheduled for October 2028. Responsibilities cover design coordination, timeline management, budgeting, quality assurance, safety protocols and risk mitigation, linking SK hynix's Korean headquarters with its U.S. partners.
Excavation of the site started in March, and the facility will focus on high-bandwidth memory chip packaging. HanmiGlobal said the assignment reflects a broader trend of Korean manufacturers seeking specialized U.S. project managers to handle distinct procurement, contracting, permitting and labor environments. The company currently oversees roughly 20 advanced-manufacturing projects for Korean clients across sectors such as semiconductors, batteries and subsea cables.
Why it matters
The project marks SK hynix's first U.S. advanced packaging fab, signaling deeper Korean tech investment in American manufacturing.
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