Henkel expands Korean semiconductor adhesive production and R&D to meet AI chip demand
Henkel has boosted its Songdo facility in Incheon, adding capacity for semiconductor adhesives and planning a new R&D center in Seoul to support AI-driven chip packaging needs.
Henkel’s 10,144-square-metre Songdo factory, finished in 2022 after a €35 million investment, now manufactures up to 250 metric tons of semiconductor adhesives each year, serving the AI-driven chip market. The cleanroom plant, the only one of Henkel’s four Korean sites dedicated to adhesives, supplies materials that bond, protect and dissipate heat in increasingly complex chip packages. Regional president Hendrik Kohleick highlighted the plant’s strategic role near memory leaders Samsung Electronics and SK hynix.
To keep pace with tighter thermal-management and thinner bonding layer requirements, Henkel plans a new technical center in Seoul’s Gasan Digital Complex, expected to open in March 2027, working closely with Songdo. Company officials note that AI and high-performance computing are driving demand for advanced die-attach films, underfills and encapsulants, prompting Henkel to broaden its portfolio. The location benefits from proximity to Incheon International Airport and competitive cargo rates, facilitating global distribution.
Why it matters
The expansion positions Henkel to supply critical materials for AI chips, a fast-growing segment of the semiconductor industry.
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