Hyundai Mobis to validate Korean-made automotive chips for real-world use

Hyundai Mobis announced plans to verify the real-world applicability and commercial potential of Korean-developed automotive semiconductors throughout the year, part of a broader push to reduce reliance on overseas suppliers as vehicles become more software-defined. The company has identified 19 collaborative system-chip projects with domestic firms, with 13 chips under development and nine already assigned to target vehicle models.

At the Auto Semicon Korea forum in Seongnam, Gyeonggi Province, the participant base expanded to 53 entities, covering chip design, packaging, testing and functional safety. Key figures, including Industry Minister Kim Jung-kwan, discussed concrete steps to localise system semiconductors, advance power-chip technology, and align industry demand with government support. Hyundai Mobis CEO Lee Gyu-suk said the firm will create a full-cycle collaboration platform, sharing responsibilities from development through mass production to lower entry barriers for individual suppliers. The company currently mass-produces 16 types of system chips, about 20 million units annually, and is exploring joint development of next-generation power chips such as silicon-carbide and IGBT devices.