Intel installs first major truss at Ohio fab, reviving delayed construction
Intel announced the erection of its first major truss at the Ohio semiconductor plant, signaling that construction is moving forward after a pause.
Intel’s foundry chief Naga Chandrasekaran confirmed that the first major truss has been installed at the company’s Ohio semiconductor facility, marking a restart of the previously stalled project. The plant, announced in 2022 with an initial goal of shipping chips by 2025, now aims for completion in 2030, while a second fab on the site is slated for 2031. Work had been paused after early construction and a 2022 visit by then-President Joe Biden, but the recent milestone indicates renewed progress.
New CEO Lip-Bu Tan, who assumed the role in March 2025, has adopted a more cautious investment stance than predecessor Pat Gelsinger, approving projects only when demand is assured. Intel faces strong demand for its AI-focused data-center processors and has increased its 2026 capital spending target to $20 billion, also upsizing a common stock offering to fund its contract manufacturing growth. Reports that memory maker SK Hynix might lease capacity at the Ohio site remain unconfirmed.
