LG Electronics and SK Enmove partner to develop eco-friendly cooling for AI data centers

LG Electronics and SK Enmove have signed an agreement to co-develop advanced cooling materials and technologies targeting AI data centers and other high-temperature uses. Their joint work will focus on low-emission refrigerants—aiming for a global warming potential under 150 and eliminating PFAS—plus optimized compressor lubricants and immersion-cooling fluids. LG will evaluate the refrigerants for commercial HVAC systems, while SK Enmove will create and assess the candidates.

The partnership, building on an existing immersion-cooling project with Green Revolution Cooling, will also explore using the technology in energy-storage systems, electric-vehicle parts and similar equipment. Both companies cite growing demand for more energy-efficient thermal management and stricter environmental rules in Europe, North America and other markets. Executives Kim Wone-kee and Lee Jae-sung said the collaboration strengthens their next-generation thermal-management offerings and opens new global market opportunities.