Samsung Electro-Mechanics secures $271 million memory substrate contract

Samsung Electro-Mechanics disclosed a new contract valued at 360.5 billion won (approximately $271 million) to deliver high-performance package substrates for memory chips to a major global client, which remains unnamed. This one-year agreement adds to the firm’s portfolio of long-term supply deals, now covering its substrate segment. The company cited rising needs for advanced memory components as AI and high-performance computing infrastructures expand.

It emphasized its expertise in large-area fine-pattern processing and warpage control as key factors in winning the order. The deal follows several other long-term contracts signed this year for silicon capacitors, MLCCs and inductors, contributing to a total disclosed contract value of about 4.3 trillion won. Samsung aims to increase the share of such contracts to smooth earnings visibility amid industry cycles.