Taiwan and Lithuania sign MOU to develop advanced chip-packaging equipment
Taiwan and Lithuania signed a memorandum to co-develop advanced semiconductor packaging machinery, merging Lithuanian laser expertise with Taiwanese AI and imaging strengths.
During the final day of the three-day SEMICON Taiwan 2026 expo in Taipei, Taiwan and Lithuania formalised a partnership to build advanced packaging machinery for future computer chips. The memorandum of understanding, signed by ITRI President Chang Pei-zen and delegates from the Lithuanian Laser Association and the Center for Physical Sciences and Technology, aims to harness Lithuania’s laser expertise together with Taiwan’s strengths in digital imaging, precision scanning and artificial intelligence.
The two governments will jointly allocate 5.6 million euros across a two-year period to stimulate private-sector collaboration through international seminars, academic and industry exchanges, and technology matchmaking. Taiwanese trade groups - the Taiwan Electronic Equipment Industry Association and the Taiwan Electrical and Electronic Manufacturers' Association - also participated in the signing. This agreement follows a growing series of bilateral pacts since 2021 covering semiconductors, biotechnology, space technology and advanced manufacturing, underscoring deeper ties between the two economies.
