TSMC plans ten advanced packaging plants as Chiayi Science Park moves into Phase III

The National Science and Technology Council issued a notice seeking public input on Phase III expansion of the Chiayi Science Park, located in Taibao City. TSMC plans to construct five additional advanced packaging plants, which would raise its on-site total to ten and make the park the world’s largest packaging hub. Phase I already hosts two plants, while Phase II includes three more slated for completion by 2031.

The proposed Phase III area, roughly 198.65 hectares and primarily leased from Taiwan Sugar Corp, will target AI, heterogeneous integration, silicon photonics, quantum tech and net-zero initiatives. After a one-month comment window, the council will conduct feasibility studies and submit the plan to the Executive Yuan for further urban and environmental review. The expansion is driven by strong demand for TSMC’s chip-on-wafer-on-substrate technology from major customers such as Nvidia, AMD and Apple.