Gudeng Precision opens Arizona facility to support TSMC's U.S. expansion

Gudeng Precision Industrial Co., a provider of wafer and packaging handling solutions, celebrated the launch of its Arizona manufacturing plant, with chairman Chiu Ming-chien presiding over the ceremony. The new site complements Gudeng’s existing production bases in Taiwan, China and South Korea and follows the company's recent ground-breaking in Japan’s Kurume-Hirokawa New Industrial Park. Chiu explained that Arizona was selected because it hosts TSMC’s advanced wafer fab and upcoming packaging facilities, creating a dense semiconductor and aerospace cluster backed by a large talent pool and long-term state support.

By establishing a parts-processing line in Arizona, Gudeng aims to improve service to U.S. clients and grow alongside its customers. The move also aligns with broader Taiwanese tech investment in the state, which includes United Integrated Services Co. and Foxlink International Inc.